Microsemi Adds Radiation-tolerant Source Driver to Space Portfolio
09 July 2012 : PRODUCT NEWS
ALISO VIEJO, Calif.—July 9, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced the first in a new family of octal source driver integrated circuits for aerospace and other high-reliability power electronics control applications including motor control. The AAHS298B is radiation-tolerant to 100kRad (Si) total dose and screened to meet operating temperatures ranging from -55 to 125 degrees Celsius and class S and class B screening levels. The new driver can be used in conjunction with Microsemi’s radiation-hardened and -tolerant programmable logic products and diodes to easily implement redundant power management solutions.
The AAHS298B includes eight non-inverting channels and can be used to provide an interface from TTL level, five volt (V) or 12V logic systems to relays, stepper and servo motors, solenoids and other loads. Each output is capable of sourcing 700 milliamps (mA) with a withstand voltage of 50V across the full military operating range, allowing manufacturers to develop more compact solutions. It includes an internal thermal shutdown feature to protect against over-current and soft-start occurrences. Additional features include:
- Single event latch-up (SEL) immune
- Low quiescent current consumption
- Internal ground clamp diodes
- Output breakdown voltage of 50V (minimum)
- Transistor-transistor logic (TTL), 5V and 12V logic compatible
Microsemi’s radiation-tolerant and -hardened solutions portfolio includes: ICs; FPGAs; power supplies; MOSFETs; bipolar transistors and diodes; solar diodes; hybrids; and integrated custom product that include solutions with multiple organizations of memories, gate arrays and processors in various hermetically-sealed ceramic packages.
Availability and Packaging
The AAHS298B source driver is available in production now and is packaged in a 20-pin ceramic small-outline integrated circuit (SOIC) package.